Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824015 | Structure and method for sealing a silicon IC | Vidhya Ramachandran, Sanjay Dabral, SivaChandra Jangam, Kunzhong Hu | 2023-11-21 |
| 11749631 | Electronic package including a hybrid thermal interface material and low temperature solder patterns to improve package warpage and reliability | Wei Chen, Kunzhong Hu | 2023-09-05 |
| 11735567 | Wafer reconstitution and die-stitching | Sanjay Dabral, Kwan-Yu Lai, Kunzhong Hu, Vidhya Ramachandran | 2023-08-22 |
| 11735526 | High density 3D interconnect configuration | Sanjay Dabral, Zhitao Cao, Kunzhong Hu | 2023-08-22 |
| 11728266 | Die stitching and harvesting of arrayed structures | Sanjay Dabral, Kunzhong Hu, Raymundo M. Camenforte | 2023-08-15 |
| 11699949 | Power management system switched capacitor voltage regulator with integrated passive device | Sanjay Dabral, David A. Secker, Ralf M. Schmitt, Vidhya Ramachandran, Wenjie Mao | 2023-07-11 |
| 11670548 | Structure and method for fabricating a computing system with an integrated voltage regulator module | Vidhya Ramachandran, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more | 2023-06-06 |
| 11646302 | Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring | Wei Chen, Jie Zhao, Po-Hao Chang, Hsien-Che Lin, Ying-Chieh Ke +1 more | 2023-05-09 |
| 11594494 | High density interconnection using fanout interposer chiplet | Chonghua Zhong, Kunzhong Hu | 2023-02-28 |
| 11587909 | High bandwidth die to die interconnect with package area reduction | Chonghua Zhong, Kunzhong Hu | 2023-02-21 |
| 11561144 | Wearable electronic device with fluid-based pressure sensing | Caleb C. Han, Brad G. Boozer, Mark G. Walsh, William S. Lee, Tongbi Jiang +6 more | 2023-01-24 |
| 11545455 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Jun Chung Hsu, Chih-Ming Chung, Yifan Kao, Young Doo Jeon, Taegui Kim | 2023-01-03 |