Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545455 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Chih-Ming Chung, Jun Zhai, Yifan Kao, Young Doo Jeon, Taegui Kim | 2023-01-03 |
JH
Jun Chung Hsu
Overall (2023): #379,779 of 537,848Top 75%
1
Patents 2023