Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545455 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Jun Chung Hsu, Chih-Ming Chung, Jun Zhai, Young Doo Jeon, Taegui Kim | 2023-01-03 |