Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545455 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Jun Chung Hsu, Jun Zhai, Yifan Kao, Young Doo Jeon, Taegui Kim | 2023-01-03 |
CC
Chih-Ming Chung
Overall (2023): #492,646 of 537,848Top 95%
1
Patents 2023