Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545455 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Jun Chung Hsu, Chih-Ming Chung, Jun Zhai, Yifan Kao, Taegui Kim | 2023-01-03 |
YJ
Young Doo Jeon
Overall (2023): #194,410 of 537,848Top 40%
1
Patents 2023