| 11824015 |
Structure and method for sealing a silicon IC |
Vidhya Ramachandran, Sanjay Dabral, SivaChandra Jangam, Kunzhong Hu |
2023-11-21 |
| 11749631 |
Electronic package including a hybrid thermal interface material and low temperature solder patterns to improve package warpage and reliability |
Wei Chen, Kunzhong Hu |
2023-09-05 |
| 11735567 |
Wafer reconstitution and die-stitching |
Sanjay Dabral, Kwan-Yu Lai, Kunzhong Hu, Vidhya Ramachandran |
2023-08-22 |
| 11735526 |
High density 3D interconnect configuration |
Sanjay Dabral, Zhitao Cao, Kunzhong Hu |
2023-08-22 |
| 11728266 |
Die stitching and harvesting of arrayed structures |
Sanjay Dabral, Kunzhong Hu, Raymundo M. Camenforte |
2023-08-15 |
| 11699949 |
Power management system switched capacitor voltage regulator with integrated passive device |
Sanjay Dabral, David A. Secker, Ralf M. Schmitt, Vidhya Ramachandran, Wenjie Mao |
2023-07-11 |
| 11670548 |
Structure and method for fabricating a computing system with an integrated voltage regulator module |
Vidhya Ramachandran, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more |
2023-06-06 |
| 11646302 |
Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring |
Wei Chen, Jie Zhao, Po-Hao Chang, Hsien-Che Lin, Ying-Chieh Ke +1 more |
2023-05-09 |
| 11594494 |
High density interconnection using fanout interposer chiplet |
Chonghua Zhong, Kunzhong Hu |
2023-02-28 |
| 11587909 |
High bandwidth die to die interconnect with package area reduction |
Chonghua Zhong, Kunzhong Hu |
2023-02-21 |
| 11561144 |
Wearable electronic device with fluid-based pressure sensing |
Caleb C. Han, Brad G. Boozer, Mark G. Walsh, William S. Lee, Tongbi Jiang +6 more |
2023-01-24 |
| 11545455 |
Semiconductor packaging substrate fine pitch metal bump and reinforcement structures |
Jun Chung Hsu, Chih-Ming Chung, Yifan Kao, Young Doo Jeon, Taegui Kim |
2023-01-03 |
