Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735526 | High density 3D interconnect configuration | Sanjay Dabral, Kunzhong Hu, Jun Zhai | 2023-08-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735526 | High density 3D interconnect configuration | Sanjay Dabral, Kunzhong Hu, Jun Zhai | 2023-08-22 |