| 11831312 |
Systems and methods for implementing a scalable system |
Bahattin Kilic, Jie Zhao, Kunzhong Hu, Suk-Kyu Ryu |
2023-11-28 |
| 11824015 |
Structure and method for sealing a silicon IC |
Vidhya Ramachandran, SivaChandra Jangam, Jun Zhai, Kunzhong Hu |
2023-11-21 |
| 11811303 |
Decoupling device using stored charge reverse recovery |
Chi Nung Ni |
2023-11-07 |
| 11735567 |
Wafer reconstitution and die-stitching |
Jun Zhai, Kwan-Yu Lai, Kunzhong Hu, Vidhya Ramachandran |
2023-08-22 |
| 11735526 |
High density 3D interconnect configuration |
Zhitao Cao, Kunzhong Hu, Jun Zhai |
2023-08-22 |
| 11728266 |
Die stitching and harvesting of arrayed structures |
Jun Zhai, Kunzhong Hu, Raymundo M. Camenforte |
2023-08-15 |
| 11699949 |
Power management system switched capacitor voltage regulator with integrated passive device |
David A. Secker, Jun Zhai, Ralf M. Schmitt, Vidhya Ramachandran, Wenjie Mao |
2023-07-11 |
