Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824015 | Structure and method for sealing a silicon IC | Vidhya Ramachandran, Sanjay Dabral, Jun Zhai, Kunzhong Hu | 2023-11-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824015 | Structure and method for sealing a silicon IC | Vidhya Ramachandran, Sanjay Dabral, Jun Zhai, Kunzhong Hu | 2023-11-21 |