Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670548 | Structure and method for fabricating a computing system with an integrated voltage regulator module | Vidhya Ramachandran, Jun Zhai, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more | 2023-06-06 |
| 11594494 | High density interconnection using fanout interposer chiplet | Jun Zhai, Kunzhong Hu | 2023-02-28 |
| 11587909 | High bandwidth die to die interconnect with package area reduction | Jun Zhai, Kunzhong Hu | 2023-02-21 |