Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646302 | Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring | Wei Chen, Jie Zhao, Jun Zhai, Hsien-Che Lin, Ying-Chieh Ke +1 more | 2023-05-09 |