Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646302 | Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring | Wei Chen, Jie Zhao, Jun Zhai, Po-Hao Chang, Ying-Chieh Ke +1 more | 2023-05-09 |
HL
Hsien-Che Lin
Overall (2023): #420,551 of 537,848Top 80%
1
Patents 2023