Issued Patents 2022
Showing 26–50 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11372160 | Package, optical device, and manufacturing method of package | Hsien-Wei Chen | 2022-06-28 |
| 11366015 | Microelectromechanical infrared sensing device | Bor-Shiun Lee | 2022-06-21 |
| 11362065 | Package and manufacturing method thereof | Hsien-Wei Chen, Jie Chen | 2022-06-14 |
| 11362069 | Three-dimensional stacking structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen | 2022-06-14 |
| 11362066 | Semiconductor structure and manufacturing method thereof | Ying-Ju Chen, Hsien-Wei Chen | 2022-06-14 |
| 11359970 | Microelectromechanical infrared sensing apparatus having stoppers | Bor-Shiun Lee, Ying-Che Lo, Chao-Ta Huang | 2022-06-14 |
| 11362064 | Semiconductor package with shared barrier layer in redistribution and via | Hsien-Wei Chen, Ching-Jung Yang, Sung-Feng Yeh, Ying-Ju Chen | 2022-06-14 |
| 11362013 | Package structure for heat dissipation | Chen-Hua Yu, Sung-Feng Yeh | 2022-06-14 |
| 11347001 | Semiconductor structure and method of fabricating the same | Hsien-Wei Chen | 2022-05-31 |
| 11342297 | Package structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Sen-Bor Jan, Sung-Feng Yeh | 2022-05-24 |
| 11335656 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Ching-Pin Yuan, Sung-Feng Yeh, Sen-Bor Jan | 2022-05-17 |
| 11322477 | Package structure and method of fabricating the same | Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2022-05-03 |
| 11315855 | Package structure with photonic die and method | Hsien-Wei Chen, Ying-Ju Chen | 2022-04-26 |
| 11309243 | Package having different metal densities in different regions and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Sen-Bor Jan | 2022-04-19 |
| 11309291 | Die stack structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Sung-Feng Yeh, Ying-Ju Chen | 2022-04-19 |
| 11309289 | Integrated circuit package having heat dissipation structure | Hsien-Wei Chen, Chen-Hua Yu | 2022-04-19 |
| 11309223 | Method of forming semiconductor device package having dummy devices on a first die | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2022-04-19 |
| 11289450 | Semiconductor structure and manufacturing method thereof | Wen-Chih Chiou, Sung-Feng Yeh | 2022-03-29 |
| 11282784 | Semiconductor package and manufacturing method of the same | Sung-Feng Yeh, Chen-Hua Yu | 2022-03-22 |
| 11264362 | Semiconductor structure and method of fabricating the same | Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-03-01 |
| 11264343 | Bond pad structure for semiconductor device and method of forming same | Sung-Feng Yeh, Hsien-Wei Chen, Jie Chen | 2022-03-01 |
| 11257787 | Package structure and method of fabricating the same | Hsien-Wei Chen, Sung-Feng Yeh | 2022-02-22 |
| 11257791 | Stacked die structure and method of fabricating the same | Jie Chen, Hsien-Wei Chen | 2022-02-22 |
| 11251100 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and method of fabricating the semiconductor structure | Sheng-An Kuo, Ching-Jung Yang, Hsien-Wei Chen, Jie Chen | 2022-02-15 |
| 11239225 | Three-dimensional integrated circuit structures and methods of manufacturing the same | Hsien-Wei Chen, Sung-Feng Yeh | 2022-02-01 |