Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450471 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Ji-Yong Park, Sai Vadlamani +1 more | 2022-09-20 |
| 11443892 | Substrate assembly with encapsulated magnetic feature | Kyu Oh Lee, Sai Vadlamani, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more | 2022-09-13 |
| 11443885 | Thin film barrier seed metallization in magnetic-plugged through hole inductor | Kristof Darmawikarta, Srinivas V. Pietambaram, Sandeep Gaan, Sri Ranga Sai Boyapati, Prithwish Chatterjee +2 more | 2022-09-13 |
| 11432405 | Methods for attaching large components in a package substrate for advanced power delivery | Prithwish Chatterjee, Kyu Oh Lee | 2022-08-30 |
| 11417614 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Ji-Yong Park, Sai Vadlamani +1 more | 2022-08-16 |
| 11410921 | Methods to incorporate thin film capacitor sheets (TFC-S) in the build-up films | Kyu Oh Lee | 2022-08-09 |
| 11355459 | Embedding magnetic material, in a cored or coreless semiconductor package | Kyu Oh Lee, Sai Vadlamani, Junnan Zhao, Ji-Yong Park, Cheng Xu +1 more | 2022-06-07 |
| 11335632 | Magnetic inductor structures for package devices | Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Andrew J. Brown +3 more | 2022-05-17 |
| 11251113 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Lauren A. Link, Andrew J. Brown +2 more | 2022-02-15 |
| 11244912 | Semiconductor package having a coaxial first layer interconnect | Sai Vadlamani, Aleksandar Aleksov, Kyu Oh Lee, Kristof Darmawikarta, Robert Alan May +2 more | 2022-02-08 |