Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538677 | Systems and methods for depositing high density and high tensile stress films | Chuanxi Yang, Hang Yu, Yu-Chi Yang, Chuan Ying Wang, Allison Yau +2 more | 2022-12-27 |
| 11530478 | Method for forming a hydrophobic and icephobic coating | Rajeev Bajaj, Mei Chang | 2022-12-20 |
| 11515145 | Deposition of silicon boron nitride films | Chuanxi Yang, Hang Yu | 2022-11-29 |
| 11501993 | Semiconductor substrate supports with improved high temperature chucking | Jian Li, Juan Carlos Rocha-Alvarez, Zheng John Ye, Daemian Raj Benjamin Raj, Shailendra Srivastava +3 more | 2022-11-15 |
| 11430654 | Initiation modulation for plasma deposition | Madhu Santosh Kumar Mutyala, Sanjay Kamath | 2022-08-30 |
| 11339475 | Film stack overlay improvement | Xinhai Han, Daemian Raj Benjamin Raj, Kristopher Enslow, Wenjiao Wang, Masaki Ogata +8 more | 2022-05-24 |
| 11289369 | Low-k dielectric with self-forming barrier layer | Yi Ding, Shaunak Mukherjee, Bo Xie, Kang Sub Yim | 2022-03-29 |
| 11276569 | On stack overlay improvement for 3D NAND | Yongjing Lin, Tza-Jing Gung, Masaki Ogata, Yusheng Zhou, Xinhai Han +3 more | 2022-03-15 |
| 11270903 | Multi zone electrostatic chuck | Madhu Santosh Kumar Mutyala, Sanjay Kamath | 2022-03-08 |
| 11217443 | Sequential deposition and high frequency plasma treatment of deposited film on patterned and un-patterned substrates | Vinayak Veer Vats, Hang Yu, Philip Allan Kraus, Sanjay Kamath, William J. Durand +6 more | 2022-01-04 |