Issued Patents 2022
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244860 | Double patterning interconnect integration scheme with SAV | Shyng-Tsong Chen, Terry A. Spooner, Koichi Motoyama | 2022-02-08 |
| 11244854 | Dual damascene fully aligned via in interconnects | Kenneth Chun Kuen Cheng, Koichi Motoyama, Chanro Park | 2022-02-08 |
| 11244850 | On integrated circuit (IC) device simultaneously formed capacitor and resistor | Jim Shih-Chun Liang, Baozhen Li | 2022-02-08 |
| 11244853 | Fully aligned via interconnects with partially removed etch stop layer | Koichi Motoyama, Kenneth Chun Kuen Cheng, Chanro Park | 2022-02-08 |
| 11244907 | Metal surface preparation for increased alignment contrast | Tianji Zhou, Saumya Sharma, Dominik Metzler, Theodorus E. Standaert | 2022-02-08 |
| 11244897 | Back end of line metallization | Chanro Park, Koichi Motoyama, Kenneth Chun Kuen Cheng, Somnath Ghosh | 2022-02-08 |
| 11244861 | Method and structure for forming fully-aligned via | Ruilong Xie, Christopher J. Waskiewicz, Huai Huang | 2022-02-08 |
| 11239165 | Method of forming an interconnect structure with enhanced corner connection | Ruilong Xie, Christopher J. Waskiewicz, Kangguo Cheng | 2022-02-01 |
| 11239278 | Bottom conductive structure with a limited top contact area | Baozhen Li, Theodorus E. Standaert, Koichi Motoyama | 2022-02-01 |
| 11239160 | E-fuse with dielectric zipping | Tianji Zhou, Saumya Sharma, Ashim Dutta | 2022-02-01 |
| 11227892 | MRAM integration with BEOL interconnect including top via | Ashim Dutta, Ekmini Anuja De Silva, Dominik Metzler | 2022-01-18 |
| 11227997 | Planar resistive random-access memory (RRAM) device with a shared top electrode | Ashim Dutta, Saumya Sharma, Tianji Zhou | 2022-01-18 |
| 11227792 | Interconnect structures including self aligned vias | Terry A. Spooner, Koichi Motoyama, Shyng-Tsong Chen | 2022-01-18 |
| 11222815 | Semiconductor device with reduced via resistance | Conal E. Murray | 2022-01-11 |
| 11223655 | Semiconductor tool matching and manufacturing management in a blockchain | Prasad Bhosale, Nicholas Anthony Lanzillo, Michael Rizzolo | 2022-01-11 |
| 11222817 | Advanced copper interconnects with hybrid microstructure | Daniel C. Edelstein | 2022-01-11 |
| 11217742 | Bottom electrode for semiconductor memory device | Theodorus E. Standaert, Daniel C. Edelstein | 2022-01-04 |