Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11361987 | Forming decoupled interconnects | Ashim Dutta, Tianji Zhou, Chih-Chao Yang | 2022-06-14 |
| 11251368 | Interconnect structures with selective capping layer | Tianji Zhou, Ashim Dutta, Chih-Chao Yang | 2022-02-15 |
| 11244907 | Metal surface preparation for increased alignment contrast | Tianji Zhou, Dominik Metzler, Chih-Chao Yang, Theodorus E. Standaert | 2022-02-08 |
| 11239160 | E-fuse with dielectric zipping | Tianji Zhou, Ashim Dutta, Chih-Chao Yang | 2022-02-01 |
| 11227997 | Planar resistive random-access memory (RRAM) device with a shared top electrode | Ashim Dutta, Tianji Zhou, Chih-Chao Yang | 2022-01-18 |