Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404317 | Method for fabricating a semiconductor device including self-aligned top via formation at line ends | John C. Arnold, Ashim Dutta, Ekmini Anuja De Silva | 2022-08-02 |
| 11276607 | Selective patterning of vias with hardmasks | John C. Arnold, Ashim Dutta, Timothy Mathew Philip, Sagarika Mukesh | 2022-03-15 |
| 11244907 | Metal surface preparation for increased alignment contrast | Tianji Zhou, Saumya Sharma, Chih-Chao Yang, Theodorus E. Standaert | 2022-02-08 |
| 11227892 | MRAM integration with BEOL interconnect including top via | Ashim Dutta, Chih-Chao Yang, Ekmini Anuja De Silva | 2022-01-18 |
| 11223008 | Pillar-based memory hardmask smoothing and stress reduction | Michael Rizzolo, Theodorus E. Standaert, Ashim Dutta | 2022-01-11 |