| 11502242 |
Embedded memory devices |
Chih-Chao Yang, Michael Rizzolo, Theodorus E. Standaert |
2022-11-15 |
| 11501969 |
Direct extreme ultraviolet lithography on hard mask with reverse tone |
Yann Mignot, Yongan Xu, Ekmini Anuja De Silva, Chi-Chun Liu |
2022-11-15 |
| 11500293 |
Patterning material film stack with hard mask layer configured to support selective deposition on patterned resist layer |
Ekmini Anuja De Silva, Indira Seshadri, Jing Guo, Nelson Felix |
2022-11-15 |
| 11495538 |
Fully aligned via for interconnect |
Ruilong Xie, Christopher J. Waskiewicz, Chih-Chao Yang, Lawrence A. Clevenger |
2022-11-08 |
| 11462583 |
Embedding magneto-resistive random-access memory devices between metal levels |
Chih-Chao Yang, Daniel C. Edelstein, John C. Arnold, Theodorus E. Standaert |
2022-10-04 |
| 11437083 |
Two-bit magnetoresistive random-access memory device architecture |
Eric Raymond Evarts |
2022-09-06 |
| 11404317 |
Method for fabricating a semiconductor device including self-aligned top via formation at line ends |
John C. Arnold, Dominik Metzler, Ekmini Anuja De Silva |
2022-08-02 |
| 11373880 |
Creating different width lines and spaces in a metal layer |
Christopher J. Penny, Ekmini Anuja De Silva, Abraham Arceo de la Pena |
2022-06-28 |
| 11361987 |
Forming decoupled interconnects |
Saumya Sharma, Tianji Zhou, Chih-Chao Yang |
2022-06-14 |
| 11355442 |
Forming self-aligned multi-metal interconnects |
Ekmini Anuja De Silva |
2022-06-07 |
| 11302639 |
Footing flare pedestal structure |
Chih-Chao Yang, Baozhen Li |
2022-04-12 |
| 11302573 |
Semiconductor structure with fully aligned vias |
Ekmini Anuja De Silva, Praveen Joseph, Nelson Felix |
2022-04-12 |
| 11276607 |
Selective patterning of vias with hardmasks |
John C. Arnold, Dominik Metzler, Timothy Mathew Philip, Sagarika Mukesh |
2022-03-15 |
| 11251368 |
Interconnect structures with selective capping layer |
Tianji Zhou, Saumya Sharma, Chih-Chao Yang |
2022-02-15 |
| 11239160 |
E-fuse with dielectric zipping |
Tianji Zhou, Saumya Sharma, Chih-Chao Yang |
2022-02-01 |
| 11227892 |
MRAM integration with BEOL interconnect including top via |
Chih-Chao Yang, Ekmini Anuja De Silva, Dominik Metzler |
2022-01-18 |
| 11227997 |
Planar resistive random-access memory (RRAM) device with a shared top electrode |
Saumya Sharma, Tianji Zhou, Chih-Chao Yang |
2022-01-18 |
| 11223008 |
Pillar-based memory hardmask smoothing and stress reduction |
Michael Rizzolo, Theodorus E. Standaert, Dominik Metzler |
2022-01-11 |
