Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515279 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Rajesh Katkar, Laura Wills Mirkarimi | 2022-11-29 |
| 11417576 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Ilyas Mohammed | 2022-08-16 |
| 11393779 | Large metal pads over TSV | Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Belgacem Haba +1 more | 2022-07-19 |
| 11355404 | Mitigating surface damage of probe pads in preparation for direct bonding of a substrate | Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2022-06-07 |
| 11348801 | Processing stacked substrates | Cyprian Emeka Uzoh | 2022-05-31 |
| 11302616 | Integrated interposer solutions for 2D and 3D IC packaging | Hong Shen, Charles G. Woychik, Arkalgud R. Sitaram | 2022-04-12 |
| 11296053 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi +3 more | 2022-04-05 |
| 11296044 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Javier A. Delacruz, Shaowu Huang, Liang Wang, Gaius Gillman Fountain, Jr., Rajesh Katkar +1 more | 2022-04-05 |
| 11257727 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Ilyas Mohammed | 2022-02-22 |
| 11244916 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar, Laura Wills Mirkarimi | 2022-02-08 |