Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515202 | 3D IC method and device | Paul M. Enquist, Qin-Yi Tong | 2022-11-29 |
| 11393779 | Large metal pads over TSV | Guilian Gao, Bongsub Lee, Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Belgacem Haba +1 more | 2022-07-19 |
| 11355404 | Mitigating surface damage of probe pads in preparation for direct bonding of a substrate | Guilian Gao, Laura Wills Mirkarimi | 2022-06-07 |
| 11296044 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Javier A. Delacruz, Shaowu Huang, Liang Wang, Rajesh Katkar +1 more | 2022-04-05 |
| 11296053 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Laura Wills Mirkarimi +3 more | 2022-04-05 |
| 11289372 | 3D IC method and device | Paul M. Enquist, Qin-Yi Tong | 2022-03-29 |