| 11515279 |
Low temperature bonded structures |
Cyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Guilian Gao, Laura Wills Mirkarimi |
2022-11-29 |
| 11476213 |
Bonded structures without intervening adhesive |
Belgacem Haba, Ilyas Mohammed, Javier A. Delacruz |
2022-10-18 |
| 11469214 |
Stacked architecture for three-dimensional NAND |
Stephen L. Morein, Javier A. Delacruz, Xu Chang, Belgacem Haba |
2022-10-11 |
| 11417576 |
Seal for microelectronic assembly |
Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed |
2022-08-16 |
| 11404338 |
Fine pitch bva using reconstituted wafer with area array accessible for testing |
— |
2022-08-02 |
| 11404439 |
3D NAND—high aspect ratio strings and channels |
Xu Chang, Belgacem Haba |
2022-08-02 |
| 11393779 |
Large metal pads over TSV |
Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi +1 more |
2022-07-19 |
| 11387214 |
Multi-chip modules formed using wafer-level processing of a reconstituted wafer |
Liang Wang |
2022-07-12 |
| 11380597 |
Bonded structures |
Liang Wang |
2022-07-05 |
| 11373963 |
Protective elements for bonded structures |
Javier A. Delacruz, Belgacem Haba |
2022-06-28 |
| 11348898 |
Systems and methods for releveled bump planes for chiplets |
Javier A. Delacruz, Belgacem Haba, Cyprian Emeka Uzoh, Ilyas Mohammed |
2022-05-31 |
| 11329034 |
Direct-bonded LED structure contacts and substrate contacts |
Min Tao, Liang Wang, Cyprian Emeka Uzoh |
2022-05-10 |
| 11296053 |
Direct bonded stack structures for increased reliability and improved yield in microelectronics |
Cyprian Emeka Uzoh, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi +3 more |
2022-04-05 |
| 11296044 |
Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes |
Guilian Gao, Javier A. Delacruz, Shaowu Huang, Liang Wang, Gaius Gillman Fountain, Jr. +1 more |
2022-04-05 |
| 11270979 |
Symbiotic network on layers |
Javier A. Delacruz, Belgacem Haba |
2022-03-08 |
| 11256004 |
Direct-bonded lamination for improved image clarity in optical devices |
Belgacem Haba, Ilyas Mohammed |
2022-02-22 |
| 11257727 |
Seal for microelectronic assembly |
Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed |
2022-02-22 |
| 11244916 |
Low temperature bonded structures |
Cyprian Emeka Uzoh, Jeremy Alfred Theil, Guilian Gao, Laura Wills Mirkarimi |
2022-02-08 |