BL

Bongsub Lee

IT Invensas Bonding Technologies: 1 patents #12 of 18Top 70%
Overall (2022): #513,943 of 548,613Top 95%
1
Patents 2022

Issued Patents 2022

Patent #TitleCo-InventorsDate
11393779 Large metal pads over TSV Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Belgacem Haba +1 more 2022-07-19