Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515279 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Rajesh Katkar, Guilian Gao | 2022-11-29 |
| 11393779 | Large metal pads over TSV | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba +1 more | 2022-07-19 |
| 11367652 | Microelectronic assembly from processed substrate | Cyprian Emeka Uzoh | 2022-06-21 |
| 11355404 | Mitigating surface damage of probe pads in preparation for direct bonding of a substrate | Guilian Gao, Gaius Gillman Fountain, Jr. | 2022-06-07 |
| 11296053 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr. +3 more | 2022-04-05 |
| 11244916 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar, Guilian Gao | 2022-02-08 |