Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296053 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi +3 more | 2022-04-05 |