Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515279 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2022-11-29 |
| 11417576 | Seal for microelectronic assembly | Rajesh Katkar, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2022-08-16 |
| 11387214 | Multi-chip modules formed using wafer-level processing of a reconstituted wafer | Rajesh Katkar | 2022-07-12 |
| 11380597 | Bonded structures | Rajesh Katkar | 2022-07-05 |
| 11329034 | Direct-bonded LED structure contacts and substrate contacts | Min Tao, Rajesh Katkar, Cyprian Emeka Uzoh | 2022-05-10 |
| 11296044 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Javier A. Delacruz, Shaowu Huang, Gaius Gillman Fountain, Jr., Rajesh Katkar +1 more | 2022-04-05 |
| 11257727 | Seal for microelectronic assembly | Rajesh Katkar, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2022-02-22 |