Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417576 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Guilian Gao, Ilyas Mohammed | 2022-08-16 |
| 11395401 | Printed circuit board structure and method for improved electromagnetic compatibility performance | Dance Wu | 2022-07-19 |
| 11369020 | Stacked transmission line | Javier A. Delacruz, Belgacem Haba | 2022-06-21 |
| 11355443 | Dielets on flexible and stretchable packaging for microelectronics | Javier A. Delacruz | 2022-06-07 |
| 11335647 | Wire bonding method and apparatus for electromagnetic interference shielding | Javier A. Delacruz | 2022-05-17 |
| 11296044 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Javier A. Delacruz, Liang Wang, Gaius Gillman Fountain, Jr., Rajesh Katkar +1 more | 2022-04-05 |
| 11289333 | Direct-bonded native interconnects and active base die | Javier A. Delacruz, Steven Teig, William C. Plants, David Edward Fisch | 2022-03-29 |
| 11257727 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Guilian Gao, Ilyas Mohammed | 2022-02-22 |