Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289333 | Direct-bonded native interconnects and active base die | Javier A. Delacruz, Steven Teig, Shaowu Huang, David Edward Fisch | 2022-03-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289333 | Direct-bonded native interconnects and active base die | Javier A. Delacruz, Steven Teig, Shaowu Huang, David Edward Fisch | 2022-03-29 |