Issued Patents 2022
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515291 | Integrated voltage regulator and passive components | Don Draper, Belgacem Haba, Ilyas Mohammed | 2022-11-29 |
| 11476213 | Bonded structures without intervening adhesive | Belgacem Haba, Rajesh Katkar, Ilyas Mohammed | 2022-10-18 |
| 11469214 | Stacked architecture for three-dimensional NAND | Stephen L. Morein, Xu Chang, Belgacem Haba, Rajesh Katkar | 2022-10-11 |
| 11385278 | Security circuitry for bonded structures | Belgacem Haba, Guy Regev | 2022-07-12 |
| 11373963 | Protective elements for bonded structures | Belgacem Haba, Rajesh Katkar | 2022-06-28 |
| 11369020 | Stacked transmission line | Shaowu Huang, Belgacem Haba | 2022-06-21 |
| 11355443 | Dielets on flexible and stretchable packaging for microelectronics | Shaowu Huang | 2022-06-07 |
| 11348898 | Systems and methods for releveled bump planes for chiplets | Belgacem Haba, Cyprian Emeka Uzoh, Rajesh Katkar, Ilyas Mohammed | 2022-05-31 |
| 11335647 | Wire bonding method and apparatus for electromagnetic interference shielding | Shaowu Huang | 2022-05-17 |
| 11296044 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Shaowu Huang, Liang Wang, Gaius Gillman Fountain, Jr., Rajesh Katkar +1 more | 2022-04-05 |
| 11289333 | Direct-bonded native interconnects and active base die | Steven Teig, Shaowu Huang, William C. Plants, David Edward Fisch | 2022-03-29 |
| 11270979 | Symbiotic network on layers | Belgacem Haba, Rajesh Katkar | 2022-03-08 |
| 11264357 | Mixed exposure for large die | Belgacem Haba | 2022-03-01 |
| 11264361 | Network on layer enabled architectures | Belgacem Haba | 2022-03-01 |