Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398258 | Multi-die module with low power operation | — | 2022-07-26 |
| 11289333 | Direct-bonded native interconnects and active base die | Javier A. Delacruz, Steven Teig, Shaowu Huang, William C. Plants | 2022-03-29 |