| 11515291 |
Integrated voltage regulator and passive components |
Javier A. Delacruz, Don Draper, Belgacem Haba |
2022-11-29 |
| 11476213 |
Bonded structures without intervening adhesive |
Belgacem Haba, Rajesh Katkar, Javier A. Delacruz |
2022-10-18 |
| 11424211 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2022-08-23 |
| 11417576 |
Seal for microelectronic assembly |
Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao |
2022-08-16 |
| 11387202 |
Nanowire bonding interconnect for fine-pitch microelectronics |
Belgacem Haba |
2022-07-12 |
| 11348898 |
Systems and methods for releveled bump planes for chiplets |
Javier A. Delacruz, Belgacem Haba, Cyprian Emeka Uzoh, Rajesh Katkar |
2022-05-31 |
| 11257727 |
Seal for microelectronic assembly |
Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao |
2022-02-22 |
| 11256004 |
Direct-bonded lamination for improved image clarity in optical devices |
Belgacem Haba, Rajesh Katkar |
2022-02-22 |
| 11246230 |
Configurable smart object system with methods of making modules and contactors |
Belgacem Haba, Gabriel Z. Guevara, Min Tao |
2022-02-08 |
| 11244477 |
Compressive sensing based image processing |
— |
2022-02-08 |
| 11239587 |
Configurable smart object system with clip-based connectors |
Belgacem Haba, Gabriel Z. Guevara, Min Tao |
2022-02-01 |