Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424211 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2022-08-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424211 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2022-08-23 |