Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515202 | 3D IC method and device | Gaius Gillman Fountain, Jr., Qin-Yi Tong | 2022-11-29 |
| 11289372 | 3D IC method and device | Gaius Gillman Fountain, Jr., Qin-Yi Tong | 2022-03-29 |
| 11276676 | Stacked devices and methods of fabrication | Belgacem Haba | 2022-03-15 |
| 11264345 | Conductive barrier direct hybrid bonding | — | 2022-03-01 |