Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495579 | Capacitive coupling in a direct-bonded interface for microelectronic devices | Belgacem Haba | 2022-11-08 |
| 11302616 | Integrated interposer solutions for 2D and 3D IC packaging | Hong Shen, Charles G. Woychik, Guilian Gao | 2022-04-12 |