Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335669 | Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias | Jiro Yota, Viswanathan Ramanathan | 2022-05-17 |
| 11302616 | Integrated interposer solutions for 2D and 3D IC packaging | Charles G. Woychik, Arkalgud R. Sitaram, Guilian Gao | 2022-04-12 |
| 11247154 | Truncated filter capsule | ZhenWu Lin, Stephan Brinke-Seiferth | 2022-02-15 |