Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387193 | Method of making moisture barrier for bond pads and integrated circuit having the same | Shiban K. Tiku | 2022-07-12 |
| 11335669 | Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias | Hong Shen, Viswanathan Ramanathan | 2022-05-17 |
| 11257774 | Stack structures in electronic devices including passivation layers for distributing compressive force | Dogan Gunes | 2022-02-22 |
| 11222855 | Moisture barrier for bond pads and integrated circuit having the same | Shiban K. Tiku | 2022-01-11 |