Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867926 | High density interconnect structures configured for manufacturing and performance | Henning Braunisch, Ajay Jain, Zhiguo Qian | 2020-12-15 |
| 10854539 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Yu Zhang | 2020-12-01 |
| 10833020 | High density interconnect structures configured for manufacturing and performance | Henning Braunisch, Ajay Jain, Zhiguo Qian | 2020-11-10 |
| 10804650 | Electrical connector having offset contacts for minimizing or cancelling crosstalk | Jeffrey Lee, Brent R. Rothermel | 2020-10-13 |
| 10784204 | Rlink—die to die channel interconnect configurations to improve signaling | Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Wilfred Gomes, Yu Zhang +7 more | 2020-09-22 |
| 10748842 | Package substrates with magnetic build-up layers | Zhiguo Qian, Kaladhar Radhakrishnan | 2020-08-18 |
| 10716231 | Pin count socket having reduced pin count and pattern transformation | Srikant Nekkanty, Zhichao Zhang | 2020-07-14 |
| 10692847 | Inorganic interposer for multi-chip packaging | Daniel N. Sobieski, Kristof Darmawikarta, Sri Ranga Sai Boyapati, Merve Celikkol, Kyu Oh Lee +1 more | 2020-06-23 |
| 10607951 | Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices | Yu Zhang, Gabriel Regalado Silva, Zhiguo Qian | 2020-03-31 |
| 10580734 | Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices | Yu Zhang, Gabriel Regalado Silva, Zhiguo Qian | 2020-03-03 |