Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10816483 | Double pass diluted ultraviolet reticle inspection | Jed H. Rankin, Paul Ackmann, Jung-Yu Hsieh, Ming Lei | 2020-10-27 |
| 10804170 | Device/health of line (HOL) aware eBeam based overlay (EBO OVL) structure | Hongliang Shen, Erfeng Ding, Dongsuk Park, Xiaoxiao Zhang, Lan Yang | 2020-10-13 |
| 10777413 | Interconnects with non-mandrel cuts formed by early block patterning | Yuping Ren, Haigou Huang, Sunil Kumar Singh | 2020-09-15 |
| 10770344 | Chamferless interconnect vias of semiconductor devices | Yuping Ren, Haigou Huang, Ravi Prakash Srivastava, Zhiguo Sun, Qiang Fang +1 more | 2020-09-08 |
| 10727120 | Controlling back-end-of-line dimensions of semiconductor devices | Sean Xuan Lin, Ruilong Xie, Lei Sun | 2020-07-28 |
| 10714422 | Anti-fuse with self aligned via patterning | Xiaoqiang Zhang, Jiehui Shu | 2020-07-14 |
| 10642160 | Self-aligned quadruple patterning pitch walking solution | Lei Sun, Meixiong Zhao, Erfeng Ding | 2020-05-05 |
| 10627720 | Overlay mark structures | Lei Sun, John H. Zhang, Shao Beng Law, Xunyuan Zhang, Ruilong Xie | 2020-04-21 |