Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497605 | Substrate carrier | — | 2019-12-03 |
| 10460916 | Real time monitoring with closed loop chucking force control | Wendell Glenn Boyd, Jr., Matthew J. Busche, Konstantin Makhratchev, Masanori Ono, Senh Thach | 2019-10-29 |
| 10460968 | Electrostatic chuck with variable pixelated magnetic field | Chih-Hsun Hsu, Tza-Jing Gung, Benjamin Schwarz, Shahid Rauf, Ankur Agarwal +2 more | 2019-10-29 |
| 10403534 | Pixilated cooling, temperature controlled substrate support assembly | Wendell Glenn Boyd, Jr., Matthew J. Busche, Konstantin Makhratchev, Masanori Ono, Senh Thach | 2019-09-03 |
| 10395964 | Apparatus and method for measurement of the thermal performance of an electrostatic wafer chuck | Matthew J. Busche, Michael R. Rice | 2019-08-27 |
| 10304715 | Electrostatic chuck having thermally isolated zones with minimal crosstalk | Konstantin Makhratchev, Jason Della Rosa, Hamid Noorbakhsh, Brad L. Mays, Douglas A. Buchberger, Jr. | 2019-05-28 |
| 10249526 | Substrate support assembly for high temperature processes | — | 2019-04-02 |
| 10177023 | Protective cover for electrostatic chuck | — | 2019-01-08 |