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Home › 2019 › Intel › Patrick Morrow

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Patrick Morrow — 15 Patents in 2019

Intel: 15 patents #101 of 5,769Top 2%

Portland, OR: #39 of 1,929 inventorsTop 3%

Oregon: #65 of 4,620 inventorsTop 2%

Overall (2019): #3,664 of 560,194Top 1%

15 Patents 2019

Issued Patents 2019

Showing 1–15 of 15 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10522510	Heterogeneous integration of ultrathin functional block by solid phase adhesive and selective transfer	Kimin Jun, Jacob Jensen, Paul B. Fischer	2019-12-31	$25,528,000
10490542	Integrated circuit layout using library cells with alternating conductive lines	Donald W. Nelson, Steven M. Burns	2019-11-26	$25,149,000
10490449	Techniques for revealing a backside of an integrated circuit device, and associated configurations	Il-Seok Son, Colin T. Carver, Paul B. Fischer, Kimin Jun	2019-11-26	$25,149,000
10483321	High density memory architecture using back side metal layers	Yih Wang	2019-11-19	$26,843,000
10468489	Isolation structures for an integrated circuit element and method of making same	Aaron D. Lilak, Uygar E. Avci, David L. Kencke, Kerryann Marrietta Foley, Stephen M. Cea +1 more	2019-11-05	$22,190,000
10453679	Methods and devices integrating III-N transistor circuitry with Si transistor circuitry	Sansaptak Dasgupta, Marko Radosavljevic, Han Wui Then, Ravi Pillarisetty, Kimin Jun +3 more	2019-10-22	$16,310,000
10439057	Multi-gate high electron mobility transistors and methods of fabrication	Kimin Jun, Sansaptak Dasgupta, Alejandro X. Levander	2019-10-08	$19,521,000
10396045	Metal on both sides of the transistor integrated with magnetic inductors	Paul B. Fischer	2019-08-27	$17,353,000
10367070	Methods of forming backside self-aligned vias and structures formed thereby	Mauro J. Kobrinsky, Kimin Jun, Il-Seok Son, Paul B. Fischer	2019-07-30	$29,864,000
10361090	Vertical channel transistors fabrication process by selective subtraction of a regular grid	Kimin Jun, Donald W. Nelson	2019-07-23	$32,139,000
10325840	Metal on both sides with power distributed through the silicon	Donald W. Nelson, Mark Bohr	2019-06-18	$21,210,000
10304946	Vertical integration scheme and circuit elements architecture for area scaling of semiconductor devices	Rishabh Mehandru, Ranjith Kumar, Cory E. Weber, Seiyon Kim, Stephen M. Cea +1 more	2019-05-28	$17,387,000
10297592	Monolithic three-dimensional (3D) ICs with local inter-level interconnects	Kimin Jun, M. Clair Webb, Donald W. Nelson	2019-05-21	$20,944,000
10236282	Partial layer transfer system and method	Kimin Jun, Il-Seok Son, Rajashree Baskaran, Paul B. Fischer	2019-03-19	$29,538,000
10186484	Metal on both sides with clock gated-power and signal routing underneath	Donald W. Nelson, Kimin Jun	2019-01-22	$27,645,000