Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heterogeneous integration of ultrathin functional block by solid phase adhesive and selective transfer

Heterogeneous integration of ultrathin functional block by solid phase adhesive and selective transfer

US Patent 10522510 · Granted Dec 31, 2019

Estimated economic value: $25,528,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Vertically spaced intra-level interconnect line metallization for integrated cir2025
Packaging architecture with intermediate routing layers2025
Inductor and transformer semiconductor devices using hybrid bonding technology2025
Monolithic chip stacking using a die with double-sided interconnect layers2025
Device, method and system to mitigate stress on hybrid bonds in a multi-tier arr2025
SRAM with P-type access transistors and complementary field-effect transistor te2025
Microelectronic assemblies having backside die-to-package interconnects2025
Bilayer memory stacking with computer logic circuits shared between bottom and t2025
Digitally controlled lithographically-defined multi-frequency acoustic resonator2025
Digitally controlled lithographically-defined multi-frequency acoustic resonator2025
Gate-to-gate isolation for stacked transistor architecture via selective dielect2025
Monolithic chip stacking using a die with double-sided interconnect layers2025