Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10488438 | High density and fine pitch interconnect structures in an electric test apparatus | Pooya Tadayon, Joe Walczyk | 2019-11-26 | $25,149,000 |
| 10490662 | Semiconductor device having tipless epitaxial source/drain regions | — | 2019-11-26 | $25,149,000 |
| 10325840 | Metal on both sides with power distributed through the silicon | Donald W. Nelson, Patrick Morrow | 2019-06-18 | $21,210,000 |
| 10319812 | Self-aligned gate edge and local interconnect and method to fabricate same | Milton Clair Webb, Tahir Ghani, Szuya S. Liao | 2019-06-11 | $16,707,000 |
| 10249588 | Designs and methods for conductive bumps | Valery M. Dubin, Sridhar Balakrishnan | 2019-04-02 | $26,887,000 |
| 10192783 | Gate contact structure over active gate and method to fabricate same | Abhijit Jayant Pethe, Tahir Ghani, Clair Webb, Harry Gomez, Annalisa Cappellani | 2019-01-29 | $23,219,000 |