Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10488438 | High density and fine pitch interconnect structures in an electric test apparatus | Pooya Tadayon, Mark Bohr | 2019-11-26 | $25,149,000 |
| 10338099 | Low profile edge clamp socket | Christopher Del Barga, Ronald Michael Kirby | 2019-07-02 | $19,690,000 |
| 10324112 | Package testing system and method with contact alignment | Mohanraj Prabhugoud, Andrew Hoitink, Abram M. Detofsky | 2019-06-18 | $21,210,000 |