Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10488438 | High density and fine pitch interconnect structures in an electric test apparatus | Pooya Tadayon, Mark Bohr | 2019-11-26 |
| 10338099 | Low profile edge clamp socket | Christopher Del Barga, Ronald Michael Kirby | 2019-07-02 |
| 10324112 | Package testing system and method with contact alignment | Mohanraj Prabhugoud, Andrew Hoitink, Abram M. Detofsky | 2019-06-18 |