| 10522510 |
Heterogeneous integration of ultrathin functional block by solid phase adhesive and selective transfer |
Jacob Jensen, Patrick Morrow, Paul B. Fischer |
2019-12-31 |
| 10490449 |
Techniques for revealing a backside of an integrated circuit device, and associated configurations |
Il-Seok Son, Colin T. Carver, Paul B. Fischer, Patrick Morrow |
2019-11-26 |
| 10453679 |
Methods and devices integrating III-N transistor circuitry with Si transistor circuitry |
Sansaptak Dasgupta, Marko Radosavljevic, Han Wui Then, Ravi Pillarisetty, Patrick Morrow +3 more |
2019-10-22 |
| 10439057 |
Multi-gate high electron mobility transistors and methods of fabrication |
Sansaptak Dasgupta, Alejandro X. Levander, Patrick Morrow |
2019-10-08 |
| 10367070 |
Methods of forming backside self-aligned vias and structures formed thereby |
Patrick Morrow, Mauro J. Kobrinsky, Il-Seok Son, Paul B. Fischer |
2019-07-30 |
| 10361090 |
Vertical channel transistors fabrication process by selective subtraction of a regular grid |
Patrick Morrow, Donald W. Nelson |
2019-07-23 |
| 10297592 |
Monolithic three-dimensional (3D) ICs with local inter-level interconnects |
Patrick Morrow, M. Clair Webb, Donald W. Nelson |
2019-05-21 |
| 10236282 |
Partial layer transfer system and method |
Patrick Morrow, Il-Seok Son, Rajashree Baskaran, Paul B. Fischer |
2019-03-19 |
| 10186484 |
Metal on both sides with clock gated-power and signal routing underneath |
Donald W. Nelson, Patrick Morrow |
2019-01-22 |