| 10522510 |
Heterogeneous integration of ultrathin functional block by solid phase adhesive and selective transfer |
Kimin Jun, Jacob Jensen, Patrick Morrow |
2019-12-31 |
| 10490449 |
Techniques for revealing a backside of an integrated circuit device, and associated configurations |
Il-Seok Son, Colin T. Carver, Patrick Morrow, Kimin Jun |
2019-11-26 |
| 10453679 |
Methods and devices integrating III-N transistor circuitry with Si transistor circuitry |
Sansaptak Dasgupta, Marko Radosavljevic, Han Wui Then, Ravi Pillarisetty, Kimin Jun +3 more |
2019-10-22 |
| 10396045 |
Metal on both sides of the transistor integrated with magnetic inductors |
Patrick Morrow |
2019-08-27 |
| 10367070 |
Methods of forming backside self-aligned vias and structures formed thereby |
Patrick Morrow, Mauro J. Kobrinsky, Kimin Jun, Il-Seok Son |
2019-07-30 |
| 10236282 |
Partial layer transfer system and method |
Patrick Morrow, Kimin Jun, Il-Seok Son, Rajashree Baskaran |
2019-03-19 |