Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10297592 | Monolithic three-dimensional (3D) ICs with local inter-level interconnects | Patrick Morrow, Kimin Jun, Donald W. Nelson | 2019-05-21 | $20,944,000 |
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Skip to contentShowing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10297592 | Monolithic three-dimensional (3D) ICs with local inter-level interconnects | Patrick Morrow, Kimin Jun, Donald W. Nelson | 2019-05-21 | $20,944,000 |