Issued Patents 2018
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9928883 | TFD I/O partition for high-speed, high-density applications | Zhuowen Sun, Kyong-Mo Bang, Wael Zohni | 2018-03-27 |
| 9917042 | 2.5D microelectronic assembly and method with circuit structure formed on carrier | Sean MORAN | 2018-03-13 |
| 9911717 | Stackable microelectronic package structures | Kyong-Mo Bang | 2018-03-06 |
| 9899353 | Off-chip vias in stacked chips | Ilyas Mohammed, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi | 2018-02-20 |
| 9893030 | Reliable device assembly | Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman, Terrence Caskey | 2018-02-13 |
| 9893033 | Off substrate kinking of bond wire | Reynaldo Co, Rizza Lee Saga Cizek, Wael Zohni | 2018-02-13 |
| 9871014 | 3D-joining of microelectronic components with conductively self-adjusting anisotropic matrix | — | 2018-01-16 |
| 9856135 | Microelectronic interconnect element with decreased conductor spacing | Chang Myung Ryu, Kimitaka Endo, Yoichi Kubota | 2018-01-02 |
| 9859257 | Flipped die stacks with multiple rows of leadframe interconnects | Javier A. Delacruz, Tu Tam Vu, Rajesh Katkar | 2018-01-02 |
| 9859220 | Laminated chip having microelectronic element embedded therein | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2018-01-02 |