Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032646 | Robust multi-layer wiring elements and assemblies with embedded microelectronic elements | Belgacem Haba, Vage Oganesian | 2018-07-24 |
| 9856135 | Microelectronic interconnect element with decreased conductor spacing | Chang Myung Ryu, Belgacem Haba, Yoichi Kubota | 2018-01-02 |