| 10115672 |
Double-sided semiconductor package and dual-mold method of making same |
Pandi C. Marimuthu, Yaojian Lin |
2018-10-30 |
| 10083916 |
Semiconductor device and method of forming stress relief layer between die and interconnect structure |
Seng Guan Chow, Yaojian Yaojian |
2018-09-25 |
| 10049964 |
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units |
Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Yu Gu |
2018-08-14 |
| 9997468 |
Integrated circuit packaging system with shielding and method of manufacturing thereof |
Byung Joon Han, KyoungHee Park, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more |
2018-06-12 |
| 9978665 |
Semiconductor device and method of forming low profile fan-out package with vertical interconnection units |
Pandi C. Marimuthu, Yaojian Lin, Won Kyoung Choi |
2018-05-22 |
| 9934998 |
Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy |
Byung Joon Han, Won Kyoung Choi |
2018-04-03 |
| 9893017 |
Double-sided semiconductor package and dual-mold method of making same |
Pandi C. Marimuthu, Yaojian Lin |
2018-02-13 |
| 9865554 |
Integrated circuit packaging system with under bump metallization and method of manufacture thereof |
Kyung-Moon Kim, HeeJo Chi, JunMo Koo, Bartholomew Liao Chung Foh, Zigmund Ramirez Camacho |
2018-01-09 |