Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9966335 | Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die | NamJu Cho, HanGil Shin | 2018-05-08 |
| 9875911 | Semiconductor device and method of forming interposer with opening to contain semiconductor die | Reza A. Pagaila, Yaojian Lin, Jun Mo Koo | 2018-01-23 |
| 9865554 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Il Kwon Shim, Kyung-Moon Kim, JunMo Koo, Bartholomew Liao Chung Foh, Zigmund Ramirez Camacho | 2018-01-09 |
| 9865575 | Methods of forming conductive and insulating layers | HanGil Shin, KyungMoon Kim | 2018-01-09 |
| 9859200 | Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof | SooSan Park, Kyusang Kim, YeoChan Ko, KeoChang Lee, HeeSoo Lee | 2018-01-02 |